Superhydrophobicity‐Mediated Electrochemical Reaction Along the Solid–Liquid–Gas Triphase Interface: Edge‐Growth of Gold Architectures | Zendy

Wu Yuchen | Zendy; Liu Kesong | Zendy; Su Bin | Zendy; Jiang Lei | Zendy

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Superhydrophobicity‐Mediated Electrochemical Reaction Along the Solid–Liquid–Gas Triphase Interface: Edge‐Growth of Gold Architectures

Author(s) -

Wu Yuchen,

Liu Kesong,

Su Bin,

Jiang Lei

Publication year - 2014

Publication title -

advanced materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 10.707

H-Index - 527

eISSN - 1521-4095

pISSN - 0935-9648

DOI - 10.1002/adma.201304062

Subject(s) - pillar , materials science , wetting , electrochemistry , electrode , nanotechnology , electrolyte , enhanced data rates for gsm evolution , contact angle , chemical engineering , composite material , chemistry , mechanical engineering , telecommunications , computer science , engineering

A superhydrophobic pillar‐structured electrode leads to uncommon electrochemical behavior. The anti‐wetting reaction surface restricts the contact between electrolyte and electrode to the pillar tops, as a result of trapped air pockets in the gaps between pillars. The electrochemical reaction occurs mainly at the solid/liquid/gas triphase interface, instead of the traditional solid/liquid diphase surface, yielding unique edge‐growth structures — for example gold microflowers — on the top of each pillar.

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