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Superhydrophobicity‐Mediated Electrochemical Reaction Along the Solid–Liquid–Gas Triphase Interface: Edge‐Growth of Gold Architectures
Author(s) -
Wu Yuchen,
Liu Kesong,
Su Bin,
Jiang Lei
Publication year - 2014
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201304062
Subject(s) - pillar , materials science , wetting , electrochemistry , electrode , nanotechnology , electrolyte , enhanced data rates for gsm evolution , contact angle , chemical engineering , composite material , chemistry , mechanical engineering , telecommunications , computer science , engineering
A superhydrophobic pillar‐structured electrode leads to uncommon electrochemical behavior. The anti‐wetting reaction surface restricts the contact between electrolyte and electrode to the pillar tops, as a result of trapped air pockets in the gaps between pillars. The electrochemical reaction occurs mainly at the solid/liquid/gas triphase interface, instead of the traditional solid/liquid diphase surface, yielding unique edge‐growth structures — for example gold microflowers — on the top of each pillar.