Self‐Assembly: Self‐Tiling Monocrystalline Silicon; a Process to Produce Electrically Connected Domains of Si and Microconcentrator Solar Cell Modules on Plastic Supports (Adv. Mater. 24/2011) | Zendy

Knuesel Robert J. | Zendy; Jacobs Heiko O. | Zendy

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Self‐Assembly: Self‐Tiling Monocrystalline Silicon; a Process to Produce Electrically Connected Domains of Si and Microconcentrator Solar Cell Modules on Plastic Supports (Adv. Mater. 24/2011)

Author(s) -

Knuesel Robert J.,

Jacobs Heiko O.

Publication year - 2011

Publication title -

advanced materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 10.707

H-Index - 527

eISSN - 1521-4095

pISSN - 0935-9648

DOI - 10.1002/adma.201190087

Subject(s) - materials science , monocrystalline silicon , silicon , epitaxy , substrate (aquarium) , process (computing) , self assembly , semiconductor , optoelectronics , nanotechnology , layer (electronics) , computer science , operating system , oceanography , geology

On p. 2727 , Heiko Jacobs and co‐workers report on the liquid‐liquid‐solid self‐tiling process where inorganic semiconductor dies follow a stepwise reduction in energy. The material is first preoriented at a liquid/liquid interface, then transferred in an epitaxy‐like self‐assembly process to a solderpatterned substrate to form close‐packed domains. The inside cover shows a variety of differently shaped receptor domains and components with a large‐area, 3D, tiled region in the background.

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