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Self‐Assembly: Self‐Tiling Monocrystalline Silicon; a Process to Produce Electrically Connected Domains of Si and Microconcentrator Solar Cell Modules on Plastic Supports (Adv. Mater. 24/2011)
Author(s) -
Knuesel Robert J.,
Jacobs Heiko O.
Publication year - 2011
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201190087
Subject(s) - materials science , monocrystalline silicon , silicon , epitaxy , substrate (aquarium) , process (computing) , self assembly , semiconductor , optoelectronics , nanotechnology , layer (electronics) , computer science , operating system , oceanography , geology
On p. 2727 , Heiko Jacobs and co‐workers report on the liquid‐liquid‐solid self‐tiling process where inorganic semiconductor dies follow a stepwise reduction in energy. The material is first preoriented at a liquid/liquid interface, then transferred in an epitaxy‐like self‐assembly process to a solderpatterned substrate to form close‐packed domains. The inside cover shows a variety of differently shaped receptor domains and components with a large‐area, 3D, tiled region in the background.