Premium
Interfacial Thermal Conductance of Transfer‐Printed Metal Films
Author(s) -
Oh DongWook,
Kim Seok,
Rogers John A.,
Cahill David G.,
Sinha Sanjiv
Publication year - 2011
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201102994
Subject(s) - materials science , conductance , thermal transfer , thermal , thermal contact conductance , metal , thermal conductivity , nanotechnology , heat transfer , deposition (geology) , composite material , thermal resistance , chemical engineering , thermodynamics , condensed matter physics , metallurgy , engineering , layer (electronics) , paleontology , sediment , biology , physics
The thermal conductance of transfer‐printed interfaces is found to be surprisingly high, only a factor of 2–10 smaller than the thermal conductance of interfaces formed by physical vapor deposition. These results have practical importance for the thermal management of electronic devices assembled by transfer‐printing and provide fundamental insights on the nature of solid‐solid contacts between elastically stiff materials.