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A Novel Solution‐Stamping Process for Preparation of a Highly Conductive Aluminum Thin Film
Author(s) -
Lee Hye Moon,
Choi SiYoung,
Kim Kyung Tae,
Yun JungYeul,
Jung Dae Soo,
Park Seung Bin,
Park Jongwook
Publication year - 2011
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201102805
Subject(s) - materials science , stamping , thin film , electrical conductor , aluminium , oled , nanotechnology , diode , solution process , nanoparticle , optoelectronics , composite material , layer (electronics) , metallurgy
A novel solution‐stamping process for the preparation of a highly conductive aluminum thin film on both rigid and flexible substrates is proposed. The superior electrical properties of Al thin films fabricated by the solution‐stamping process compared to silver and gold films fabricated from colloidal nanoparticles are experimentally demonstrated, and their applications in electronic circuits on rigid and flexible substrates and to organic light‐emitting diodes (OLEDs) are investigated.