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High Seebeck Effects from Hybrid Metal/Polymer/Metal Thin‐Film Devices
Author(s) -
Yan Liang,
Shao Ming,
Wang Hsin,
Dudis Douglas,
Urbas Augustine,
Hu Bin
Publication year - 2011
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201101634
Subject(s) - materials science , thermal conduction , metal , ohmic contact , polymer , thermoelectric effect , thin film , thermal conductivity , doping , scattering , layer (electronics) , composite material , condensed matter physics , optoelectronics , nanotechnology , optics , metallurgy , physics , thermodynamics
The multi‐layer metal/polymer/metal thin‐film structure allows charge conduction but limits thermal conduction. The charge conduction is supported by Ohmic interfacial charge transfer and doped bulk transport. The thermal conduction is limited by polymer low thermal conductivity, acoustic mismatch, interfacial phonon scattering. As a result, the metal/polymer/metal thin‐film devices can demonstrate significant Seebeck effect.