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Organic Memory: Three‐Dimensional Integration of Organic Resistive Memory Devices (Adv. Mater. 44/2010)
Author(s) -
Song Sunghoon,
Cho Byungjin,
Kim TaeWook,
Ji Yongsung,
Jo Minseok,
Wang Gunuk,
Choe Minhyeok,
Kahng Yung Ho,
Hwang Hyunsang,
Lee Takhee
Publication year - 2010
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201090142
Subject(s) - materials science , stacking , fabrication , resistive random access memory , resistive touchscreen , optoelectronics , nanotechnology , organic electronics , electronics , electrical engineering , transistor , voltage , organic chemistry , medicine , engineering , chemistry , alternative medicine , pathology
Takhee Lee and co‐workers demonstrate on p. 5048 the fabrication of three‐dimensionally stacked 8 × 8 cross‐bar array organic resistive memory devices. These devices show non‐volatile memory switching behavior, and individual memory cells in the different layers are independently controlled and monitored. The demonstrated 3D stacking fabrication will enable high‐density integration of organic memory cells and other organic‐based electronics devices.