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Nanoparticle‐Enabled Selective Electrodeposition
Author(s) -
Feng HsienPing,
Paudel Trilochan,
Yu Bo,
Chen Shuo,
Ren Zhi Feng,
Chen Gang
Publication year - 2011
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201004656
Subject(s) - materials science , nanoparticle , platinum , nanotechnology , substrate (aquarium) , electroplating , platinum nanoparticles , adhesion , layer (electronics) , chemical engineering , composite material , catalysis , organic chemistry , chemistry , oceanography , geology , engineering
Electrodeposition of a material onto a conducting substrate with strong adhesion and exceptional uniformity through the use of platinum nanoparticles as the seed layer is reported. The use of platinum nanoparticles also creates an optimum voltage range to selectively electroplate various metals on substrate into areas seeded with the nanoparticles.