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Transfer of Functional Ceramic Thin Films Using a Thermal Release Process
Author(s) -
Dou Guangbin,
Holmes Andrew S.,
Yeatman Eric M.,
Wright Robert V.,
Kirby Paul B.,
Yin Chunyan
Publication year - 2011
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201004391
Subject(s) - materials science , ceramic , soldering , thin film , wafer , substrate (aquarium) , thermal transfer , composite material , transfer printing , process (computing) , nanotechnology , layer (electronics) , oceanography , geology , computer science , operating system
A simple, solder‐based bonding and lift‐off process for transfer of functional ceramic thin films is demonstrated. The process allows transfer of thin films from a growth wafer onto a target substrate in a single step, with separation from the growth substrate being driven by induced stresses during soldering. Free‐standing films can also be produced.