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Ultrafast Transfer of Metal‐Enhanced Carbon Nanotubes at Low Temperature for Large‐Scale Electronics Assembly
Author(s) -
Fu Yifeng,
Qin Yiheng,
Wang Teng,
Chen Si,
Liu Johan
Publication year - 2010
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201002415
Subject(s) - materials science , carbon nanotube , ultrashort pulse , nanotechnology , electronics , substrate (aquarium) , yield (engineering) , metal , composite material , metallurgy , laser , chemistry , physics , oceanography , geology , optics
An indium‐assisted ultrafast carbon nanotube (CNT) transfer method with a yield rate over 90% is described. Metal‐coated as‐transferred CNT structures exhibit excellent electrical performance that is at least one order of magnitude better than the previously published results. Shear test results show that the adhesion between CNTs and the substrate is greatly improved and excellent flexibility is obtained after the transfer process.