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Cubic Silsesquioxanes as a Green, High‐Performance Mold Material for Nanoimprint Lithography
Author(s) -
Ro Hyun Wook,
Popova Vera,
Chen Lei,
Forster Aaron M.,
Ding Yifu,
Alvine Kyle J.,
Krug Dave J.,
Laine Richard M.,
Soles Christopher L.
Publication year - 2011
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201001761
Subject(s) - materials science , silsesquioxane , nanoimprint lithography , mold , microstructure , lithography , composite material , thermal , nanotechnology , optoelectronics , polymer , fabrication , medicine , alternative medicine , pathology , physics , meteorology
One‐step direct nanoimprinting into cubic‐silsesquioxane (SSQ) films create low surface energy, high‐modulus, thermally stable, and UV‐transparent patterns that can then be used as secondary molds for both thermal and UV versions of nanoimprinting. The optimization of these materials is demonstrated by varying the microstructure of the initial SSQ material. The pattern fidelity for features as small as 10 nm is quantified using X‐ray reflectivity and AFM.
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