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Three‐Dimensional Printing of Interconnects by Laser Direct‐Write of Silver Nanopastes
Author(s) -
Wang Jiwen,
Auyeung Raymond C. Y.,
Kim Heungsoo,
Charipar Nicholas A.,
Piqué Alberto
Publication year - 2010
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.201001729
Subject(s) - polyimide , materials science , laser , process (computing) , optoelectronics , nanotechnology , computer science , optics , physics , layer (electronics) , operating system
A novel non‐contact 3‐dimensional laser direct‐write process is demonstrated. Freestanding silver interconnects with various widths (8–75 μm), loop heights (1–10 μm), and bond lengths (8–100 μm) are printed on various substrates. We demonstrate the capability of this technology for ultrafine (<1 μm) pitch bonding and for connecting LEDs embedded in flexible polyimide substrates