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Flexible Electronics: Ultrathin Silicon Circuits With Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper (Adv. Mater. 36/2009)
Author(s) -
Kim DaeHyeong,
Kim YunSoung,
Wu Jian,
Liu Zhuangjian,
Song Jizhou,
Kim HoonSik,
Huang Yonggang Y.,
Hwang KehChih,
Rogers John A.
Publication year - 2009
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200990139
Subject(s) - materials science , electronics , elastomer , stretchable electronics , substrate (aquarium) , silicon , flexible electronics , electronic circuit , adhesive , bending , optoelectronics , nanotechnology , composite material , electrical engineering , layer (electronics) , engineering , oceanography , geology
The cover shows a silicon integrated circuit on a paper substrate. The system consists of ultrathin devices electrically and mechanically interconnected with stretchable, serpentine ribbons. A low modulus elastomeric adhesive isolates the circuit from strains associated with bending and folding the paper. This strategy provides a route to high quality electronics on paper, vinyl, leather and other unusual substrates, as reported by John Rogers and co‐workers on p. 3703 .