Flexible Electronics: Ultrathin Silicon Circuits With Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper (Adv. Mater. 36/2009) | Zendy

Kim DaeHyeong | Zendy; Kim YunSoung | Zendy; Wu Jian | Zendy; Liu Zhuangjian | Zendy; Song Jizhou | Zendy; Kim HoonSik | Zendy; Huang Yonggang Y. | Zendy; Hwang KehChih | Zendy; Rogers John A. | Zendy

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Flexible Electronics: Ultrathin Silicon Circuits With Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper (Adv. Mater. 36/2009)

Author(s) -

Kim DaeHyeong,

Kim YunSoung,

Wu Jian,

Liu Zhuangjian,

Song Jizhou,

Kim HoonSik,

Huang Yonggang Y.,

Hwang KehChih,

Rogers John A.

Publication year - 2009

Publication title -

advanced materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 10.707

H-Index - 527

eISSN - 1521-4095

pISSN - 0935-9648

DOI - 10.1002/adma.200990139

Subject(s) - materials science , electronics , elastomer , stretchable electronics , substrate (aquarium) , silicon , flexible electronics , electronic circuit , adhesive , bending , optoelectronics , nanotechnology , composite material , electrical engineering , layer (electronics) , engineering , oceanography , geology

The cover shows a silicon integrated circuit on a paper substrate. The system consists of ultrathin devices electrically and mechanically interconnected with stretchable, serpentine ribbons. A low modulus elastomeric adhesive isolates the circuit from strains associated with bending and folding the paper. This strategy provides a route to high quality electronics on paper, vinyl, leather and other unusual substrates, as reported by John Rogers and co‐workers on p. 3703 .

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