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Creating In‐Plane Metallic‐Nanowire Arrays by Corner‐Mediated Electrodeposition
Author(s) -
Zhang Bo,
Weng YuYan,
Huang XiaoPing,
Wang Mu,
Peng RuWen,
Ming NaiBen,
Yang Bingjie,
Lu Nan,
Chi Lifeng
Publication year - 2009
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200900730
Subject(s) - materials science , nanowire , nucleation , nanotechnology , copper , substrate (aquarium) , polymer substrate , metal , plane (geometry) , polymer , optoelectronics , composite material , metallurgy , layer (electronics) , geometry , chemistry , oceanography , mathematics , organic chemistry , geology
A novel template‐assisted electrochemical approach to fabricate in‐plane arrays of copper nanowires with tunable width varying from 25 nm to more than 200 nm, which is realized by successive nucleation of copper at the concave corner of the polymer template and the substrate, is reported. We demonstrate that this method can be applied for fabricating complicated structures.