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Ultrarapid Transient‐liquid‐phase Bonding of Al 2 O 3 Ceramics
Author(s) -
Hong Sung M.,
Bartlow Christopher C.,
Reynolds Thomas B.,
McKeown Joseph T.,
Glaeser Andreas M.
Publication year - 2008
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200801550
Subject(s) - materials science , ceramic , liquid phase , homogenization (climate) , yield (engineering) , transient (computer programming) , phase (matter) , composite material , chemical engineering , analytical chemistry (journal) , thermodynamics , chromatography , organic chemistry , biodiversity , ecology , chemistry , physics , biology , computer science , engineering , operating system
An effective multilayer interlayer technology for rapid transient‐liquid‐phase joining of advanced ceramics is demonstrated . Interlayers designed to exhibit rapid interdiffusion, chemical homogenization, and liquid film disappearance, enable rapid and reliable joining of ceramics at reduced temperatures while preserving high‐temperature use capability. Processing times as short as 5 min at 1400 °C yield interlayers with a remelt temperature >2200 °C.