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Non‐Relief‐Pattern Lithography Patterning of Solution Processed Organic Semiconductors
Author(s) -
Park Sung Kyu,
Mourey Devin A.,
Subramanian Sankar,
Anthony John E.,
Jackson Thomas N.
Publication year - 2008
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200801133
Subject(s) - materials science , photoresist , lithography , semiconductor , organic semiconductor , monolayer , optoelectronics , nanotechnology , resist , ultraviolet , self assembled monolayer , layer (electronics)
Patterning of solution processed organic semiconductors demonstrated using a non‐relief‐pattern, photoresist‐free, lithographic process with a self‐assembled monolayer (SAM) patterned by deep ultraviolet (DUV) irradiation. The patterned, low‐surface‐energy SAM then steers the organic semiconductor solution into areas where the SAM has been removed by the DUV exposure resulting in organic semiconductor microstructures with good resolution.