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Stress‐Driven Surface Topography Evolution in Nanocrystalline Al Thin Films
Author(s) -
Gianola D. S.,
Eberl C.,
Cheng X. M.,
Hemker K. J.
Publication year - 2008
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200701607
Subject(s) - materials science , nanocrystalline material , grain boundary , thin film , stress (linguistics) , grain size , surface stress , grain growth , composite material , metallurgy , nanotechnology , microstructure , surface energy , linguistics , philosophy
Stress‐assisted grain growth at room temperature is identified as a plastic deformation mechanism in nanocrystalline thin films. Unique surface relief is attributed to the direct application of stress‐coupled grain boundary migration theory. The figure shows a false‐color SEM image of surface topography and an AFM height profile as a result of stress‐assisted grain growth. A strategy for tailoring the mechanical properties of nanostructured metals is shown.