Stress‐Driven Surface Topography Evolution in Nanocrystalline Al Thin Films | Zendy

Gianola D. S. | Zendy; Eberl C. | Zendy; Cheng X. M. | Zendy; Hemker K. J. | Zendy

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Stress‐Driven Surface Topography Evolution in Nanocrystalline Al Thin Films

Author(s) -

Gianola D. S.,

Eberl C.,

Cheng X. M.,

Hemker K. J.

Publication year - 2008

Publication title -

advanced materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 10.707

H-Index - 527

eISSN - 1521-4095

pISSN - 0935-9648

DOI - 10.1002/adma.200701607

Subject(s) - materials science , nanocrystalline material , grain boundary , thin film , stress (linguistics) , grain size , surface stress , grain growth , composite material , metallurgy , nanotechnology , microstructure , surface energy , linguistics , philosophy

Stress‐assisted grain growth at room temperature is identified as a plastic deformation mechanism in nanocrystalline thin films. Unique surface relief is attributed to the direct application of stress‐coupled grain boundary migration theory. The figure shows a false‐color SEM image of surface topography and an AFM height profile as a result of stress‐assisted grain growth. A strategy for tailoring the mechanical properties of nanostructured metals is shown.

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