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Cover Picture: 3D Polymer Microframes That Exploit Length‐Scale‐Dependent Mechanical Behavior (Adv. Mater. 16/2006)
Author(s) -
Jang J.H.,
Ullal C. K.,
Choi T.,
Lemieux M. C.,
Tsukruk V. V.,
Thomas E. L.
Publication year - 2006
Publication title -
advanced materials
Language(s) - English
Resource type - Reports
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200690065
Subject(s) - materials science , scanning electron microscope , cover (algebra) , cable gland , ductility (earth science) , deformation (meteorology) , composite material , epoxy , scale (ratio) , polymer , mechanical engineering , creep , physics , quantum mechanics , engineering
The cover shows a simulation of a four‐functional microframe network undergoing plastic deformation, illustrating the significant ductility of the connector struts between nodes, as reported for such microframes fabricated by Thomas and co‐workers on p. 2123. The inset shows a scanning electron microscopy image of an SU8 epoxy microframe in a region of the structure with large strain‐to‐break of the component struts.