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The Direct Patterning of Nanoporous Interlayer Dielectric Insulator Films by Nanoimprint Lithography
Author(s) -
Ro H. W.,
Jones R. L.,
Peng H.,
Hines D. R.,
Lee H.J.,
Lin E. K.,
Karim A.,
Yoon D. Y.,
Gidley D. W.,
Soles C. L.
Publication year - 2007
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200602872
Subject(s) - nanoporous , materials science , nanoimprint lithography , dielectric , nanoscopic scale , nanotechnology , insulator (electricity) , nanopore , thin film , lithography , optoelectronics , fabrication , medicine , alternative medicine , pathology
Nanoscale parallel line‐space patterns are imprinted into a spin‐on organosilicate thin film that contains a second phase pore generating material (porogen). Imprints are converted into nanoporous low‐dielectric patterns by vitrification at 430 °C where the porogen is volatilized and creates nanoscale pores (2.2 nm) in the vitrified organosilicate network (see figure). The results are well‐defined, high‐modulus, nanoporous patterns with an estimated dielectric constant of k ∼2.4.