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High‐Throughput and Etch‐Selective Nanoimprinting and Stamping Based on Fast‐ Thermal‐Curing Poly(dimethylsiloxane)s
Author(s) -
PinaHernandez C.,
Kim J.S.,
Guo L. J.,
Fu P.F.
Publication year - 2007
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200601905
Subject(s) - materials science , reactive ion etching , resist , curing (chemistry) , silicon , nanolithography , stamping , thermal , etching (microfabrication) , replication (statistics) , engraving , nanotechnology , composite material , fabrication , optoelectronics , layer (electronics) , metallurgy , statistics , physics , mathematics , meteorology , medicine , alternative medicine , pathology
A thermally curable poly(dimethylsiloxane)‐based nanoimprinting resist allows an extremely fast replication (few seconds) of 70 nm line‐width structures at moderate temperatures and low pressures (see figure). The high silicon content of this material also makes it highly resistant to reactive‐ion etching, allowing the imprinted pattern to be transferred into SiO 2 without any additional hard etching mask. The imprinted structure can be used as a stamp directly.