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Microsolidics: Fabrication of Three‐Dimensional Metallic Microstructures in Poly(dimethylsiloxane)
Author(s) -
Siegel A. C.,
Bruzewicz D. A.,
Weibel D. B.,
Whitesides G. M.
Publication year - 2007
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200601787
Subject(s) - fabrication , materials science , microstructure , microfluidics , soldering , nanotechnology , bent molecular geometry , 3d printing , electronic packaging , composite material , medicine , alternative medicine , pathology
The fabrication of complex metallic microstructures in 3D by injecting liquid solder into microfluidic channels and allowing the solder to cool and solidify is demonstrated; after fabrication, the metallic structures can be flexed, bent, or twisted (see figure and cover). With this method it is possible to build flexible electronic circuits, complex embedded or freestanding 3D metal microstructures, 3D electronic components, and hybrid electronic–microfluidic devices.