Simultaneously Increasing the Ductility and Strength of Ultra‐Fine‐Grained Pure Copper | Zendy

Zhao Y.H. | Zendy; Bingert J. F. | Zendy; Liao X.Z. | Zendy; Cui B.Z. | Zendy; Han K. | Zendy; Sergueeva A. V. | Zendy; Mukherjee A. K. | Zendy; Valiev R. Z. | Zendy; Langdon T. G. | Zendy; Zhu Y. T. | Zendy

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Simultaneously Increasing the Ductility and Strength of Ultra‐Fine‐Grained Pure Copper

Author(s) -

Zhao Y.H.,

Bingert J. F.,

Liao X.Z.,

Cui B.Z.,

Han K.,

Sergueeva A. V.,

Mukherjee A. K.,

Valiev R. Z.,

Langdon T. G.,

Zhu Y. T.

Publication year - 2006

Publication title -

advanced materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 10.707

H-Index - 527

eISSN - 1521-4095

pISSN - 0935-9648

DOI - 10.1002/adma.200601472

Subject(s) - ductility (earth science) , materials science , copper , mechanical strength , deformation (meteorology) , metallurgy , work (physics) , composite material , mechanical engineering , engineering , creep

Simultaneous increase of the ductility and strength of bulk ultra‐fine‐grained (UFG) Cu is achieved by introducing large amounts of deformation twins and high‐angle grain boundaries via cryodrawing and cryorolling (red plots and image). Bulk UFG materials usually have high strength but disappointingly low ductility. Most previous attempts to enhance the ductility of single‐phased UFG materials sacrificed their yield strength. This work provides a new approach for increasing ductility without sacrificing strength.

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