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Molecularly Protected Bismuth Telluride Nanoparticles: Microemulsion Synthesis and Thermoelectric Transport Properties
Author(s) -
Purkayastha A.,
Kim S.,
Gandhi D. D.,
Ganesan P. G.,
BorcaTasciuc T.,
Ramanath G.
Publication year - 2006
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200600495
Subject(s) - bismuth telluride , materials science , microemulsion , nanoparticle , thioglycolic acid , thermoelectric effect , seebeck coefficient , thermoelectric materials , bismuth , annealing (glass) , nanotechnology , figure of merit , chemical engineering , organic chemistry , optoelectronics , chemistry , metallurgy , composite material , pulmonary surfactant , thermodynamics , thermal conductivity , physics , engineering
A room‐temperature microemulsion synthesis of molecularly capped bismuth telluride nanoparticles with small (average ca. 2.5 nm) diameters is reported (see figure). The use of thioglycolic acid ligands inhibits nanoparticle agglomeration and surface oxidation. Annealing the nanoparticle films to 350 ° C yields a Seebeck coefficient of – 107 μV K –1 . The findings are attractive for realizing of high figure of merit thermoelectric materials via nanostructuring control over surface chemistry.