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Soft Deposition of Large‐Area Metal Contacts for Molecular Electronics
Author(s) -
Shimizu K. T.,
Fabbri J. D.,
Jelincic J. J.,
Melosh N. A.
Publication year - 2006
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200600195
Subject(s) - materials science , deposition (geology) , nanotechnology , electronics , polymer , molecular electronics , aqueous solution , metal , optoelectronics , composite material , molecule , metallurgy , organic chemistry , electrical engineering , chemistry , sediment , biology , engineering , paleontology
Large‐area molecular‐electronic devices are fabricated by polymer‐assisted soft deposition of the top metal contact in aqueous solution (see figure). A series of monomolecular fatty‐acid tunnel junctions and a rotaxane switching junction with working areas from 10 μm 2 to 9 mm 2 are investigated.

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