Soft Deposition of Large‐Area Metal Contacts for Molecular Electronics | Zendy

Shimizu K. T. | Zendy; Fabbri J. D. | Zendy; Jelincic J. J. | Zendy; Melosh N. A. | Zendy

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Soft Deposition of Large‐Area Metal Contacts for Molecular Electronics

Author(s) -

Shimizu K. T.,

Fabbri J. D.,

Jelincic J. J.,

Melosh N. A.

Publication year - 2006

Publication title -

advanced materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 10.707

H-Index - 527

eISSN - 1521-4095

pISSN - 0935-9648

DOI - 10.1002/adma.200600195

Subject(s) - materials science , deposition (geology) , nanotechnology , electronics , polymer , molecular electronics , aqueous solution , metal , optoelectronics , composite material , molecule , metallurgy , organic chemistry , electrical engineering , chemistry , sediment , biology , engineering , paleontology

Large‐area molecular‐electronic devices are fabricated by polymer‐assisted soft deposition of the top metal contact in aqueous solution (see figure). A series of monomolecular fatty‐acid tunnel junctions and a rotaxane switching junction with working areas from 10 μm 2 to 9 mm 2 are investigated.

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