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Self‐Assembly Process to Integrate and Connect Semiconductor Dies on Surfaces with Single‐Angular Orientation and Contact‐Pad Registration
Author(s) -
Zheng W.,
Jacobs H. O.
Publication year - 2006
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200502026
Subject(s) - materials science , orientation (vector space) , process (computing) , silicon , soldering , substrate (aquarium) , die (integrated circuit) , optoelectronics , engineering drawing , nanotechnology , composite material , computer science , geometry , engineering , oceanography , mathematics , geology , operating system
A directed self‐assembly process to batch assemble differently sized components with single angular orientation on surfaces is demonstrated. This process employs “two‐element docking sites” on the substrate that contain alignment pedestals and solder‐coated areas that are designed according to the size and shape of the components. The directed assembly of one hundred silicon blocks (see figure), 900 and 500 μm in size, is demonstrated with 19 μm lateral and 0.3° angular contact‐pad registration accuracy.