Premium
Direct‐Write Assembly of Three‐Dimensional Photonic Crystals: Conversion of Polymer Scaffolds to Silicon Hollow‐Woodpile Structures
Author(s) -
Gratson G. M.,
GarcíaSantamaría F.,
Lousse V.,
Xu M.,
Fan S.,
Lewis J. A.,
Braun P. V.
Publication year - 2006
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200501447
Subject(s) - materials science , polymer , silicon , photonic crystal , microelectromechanical systems , microfluidics , photonics , nanotechnology , rod , optoelectronics , chemical vapor deposition , composite material , medicine , alternative medicine , pathology
3D Si hollow‐woodpile photonic crystals are formed through the direct‐write assembly of concentrated polyelectrolyte inks (rods ∼1 μm in diameter) followed by a sequential silica/silicon chemical vapor deposition process (see Figure). The direct conversion of 3D polymer microstructures to materials like silicon may enable such applications as photonic materials, low‐cost microelectromechanical systems (MEMS), microfluidic networks for heat dissipation, and biological devices.