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Rigiflex Lithography for Nanostructure Transfer
Author(s) -
Suh D.,
Choi S.J.,
Lee H. H.
Publication year - 2005
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200402010
Subject(s) - materials science , lithography , soft lithography , mold , nanotechnology , transfer printing , nanoimprint lithography , acrylate , nanostructure , bilayer , photolithography , next generation lithography , substrate (aquarium) , polymer , resist , copolymer , composite material , electron beam lithography , optoelectronics , layer (electronics) , fabrication , membrane , medicine , oceanography , alternative medicine , pathology , biology , geology , genetics
Rigiflex lithography combines the mold rigidity of imprint lithography, which permits fine patterning, with the mold flexibility of soft lithography, allowing intimate contact of the mold with the surface substrate over a large area. A UV‐curable mold based on poly(urethane acrylate) is prepared as a film on a flexible poly(ethylene terephthalate) support, allowing nanopatterns to be prepared by a bilayer‐transfer technique (see Figure).