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High‐Dielectric‐Constant Silver–Epoxy Composites as Embedded Dielectrics
Author(s) -
Qi L.,
Lee B. I.,
Chen S.,
Samuels W. D.,
Exarhos G. J.
Publication year - 2005
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200401816
Subject(s) - materials science , dielectric , epoxy , composite material , nanocomposite , capacitor , high κ dielectric , composite number , nanoparticle , silver nanoparticle , matrix (chemical analysis) , polymer , nanotechnology , optoelectronics , electrical engineering , voltage , engineering
The incorporation of organic‐coated silver nanoparticles into an epoxy matrix (see Figure, a–f represent increasing Ag content) results in a flexible 0‐3 type nanocomposite with a strikingly high dielectric constant (greater than 300). The composite retains the flexibility and other mechanical properties of the polymer matrix, and may be useful in applications where capacitors are embedded into printed circuit boards.