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Boring Deep Cylindrical Nanoholes in Silicon Using Silver Nanoparticles as a Catalyst
Author(s) -
Tsujino K.,
Matsumura M.
Publication year - 2005
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200401681
Subject(s) - wafer , materials science , nanoparticle , deposition (geology) , silicon , nanotechnology , silver nanoparticle , catalysis , optoelectronics , chemical engineering , organic chemistry , paleontology , chemistry , sediment , engineering , biology
Cylindrical nanoholes reaching 500 μm in depth can be generated in Si(100) by immersing the wafer in a solution containing HF and H 2 O 2 after loading the wafer with Ag nanoparticles. At the bottom of the holes, Ag particles are observed (see Figure). This suggests that the Ag particles bore into the wafer and that the pattern of the holes can be controlled by the deposition pattern of the Ag particles.