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Metallic Thin Films of TTF[Ni(dmit) 2 ] 2 by Electrodeposition on (001)‐Oriented Silicon Substrates
Author(s) -
de Caro D.,
Fraxedas J.,
Faulmann C.,
Malfant I.,
Milon J.,
Lamère J.F.,
Collière V.,
Valade L.
Publication year - 2004
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200306427
Subject(s) - materials science , thin film , silicon , metal , crystallite , conductivity , electrical resistivity and conductivity , polycrystalline silicon , character (mathematics) , nanotechnology , optoelectronics , metallurgy , thin film transistor , chemistry , electrical engineering , layer (electronics) , geometry , mathematics , engineering
Thin films of organic metals generally exhibit activated conductivity caused by intergrain conduction barriers. One of the few examples of thin films showing truly metallic character is TTF[Ni(dmit) 2 ] 2 . Films electrodeposited on silicon substrates remain metallic down to 12 K in spite of their polycrystalline morphology (see Figure).
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