Three‐Dimensional Assembly of Polymer Microstructures at Low Temperatures | Zendy

Yang Y. | Zendy; Zeng C. | Zendy; Lee L. J. | Zendy

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Three‐Dimensional Assembly of Polymer Microstructures at Low Temperatures

Author(s) -

Yang Y.,

Zeng C.,

Lee L. J.

Publication year - 2004

Publication title -

advanced materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 10.707

H-Index - 527

eISSN - 1521-4095

pISSN - 0935-9648

DOI - 10.1002/adma.200306159

Subject(s) - materials science , polymer , microstructure , supercritical fluid , supercritical carbon dioxide , nanotechnology , bar (unit) , chemical engineering , polymer science , composite material , organic chemistry , chemistry , physics , meteorology , engineering

A low‐temperature, low‐pressure polymer bonding technique for three‐dimensional assembly of microstructures (see Figure; scale bar 5 μm) based on carbon dioxide (CO 2 )‐enhanced chain entanglement near the polymer surfaces is presented. The environmentally benign utilization of supercritical CO 2 offers scope for the production of polymer‐based biomedical applications and devices.

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