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Three‐Dimensional Assembly of Polymer Microstructures at Low Temperatures
Author(s) -
Yang Y.,
Zeng C.,
Lee L. J.
Publication year - 2004
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200306159
Subject(s) - materials science , polymer , microstructure , supercritical fluid , supercritical carbon dioxide , nanotechnology , bar (unit) , chemical engineering , polymer science , composite material , organic chemistry , chemistry , physics , meteorology , engineering
A low‐temperature, low‐pressure polymer bonding technique for three‐dimensional assembly of microstructures (see Figure; scale bar 5 μm) based on carbon dioxide (CO 2 )‐enhanced chain entanglement near the polymer surfaces is presented. The environmentally benign utilization of supercritical CO 2 offers scope for the production of polymer‐based biomedical applications and devices.