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Regular Arrays of Copper Wires Formed by Template‐Assisted Electrodeposition
Author(s) -
Zhang M.,
Lenhert S.,
Wang M.,
Chi L.,
Lu N.,
Fuchs H.,
Ming N. B.
Publication year - 2004
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200305577
Subject(s) - materials science , copper , homogeneous , copper wire , nanotechnology , metal , langmuir–blodgett film , optoelectronics , metallurgy , monolayer , physics , thermodynamics
An easy, cheap, high‐throughput way to generate metallic wire arrays by patterned electrodeposition is reported. Copper is electrodeposited on the surface of a regularly striped Langmuir–Blodgett film, forming an array of submicrometer‐wide wires with homogeneous width (see Figure). Width and separation of the wires can be tuned by the template.