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Nanoporous Structures Prepared by an Electrochemical Deposition Process
Author(s) -
Shin H.C.,
Dong J.,
Liu M.
Publication year - 2003
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.200305160
Subject(s) - materials science , tin , deposition (geology) , cathodic protection , nanoporous , electrochemistry , copper , metal , nanotechnology , chemical engineering , metallurgy , electrode , paleontology , chemistry , sediment , engineering , biology
Free‐standing metal foam structures with nano‐dendritic walls of copper and tin are fabricated by an electrochemical deposition process. This unique structure is attributed to the concurrent generation of hydrogen bubbles with extremely fast metal deposition at high cathodic current densities. The Figure shows a typical example of the foam‐like structure of tin deposits with walls composed of nano‐dendritic branches.