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The thermal decomposition of an organometallic precursor for the preparation of YBa 2 Cu 3 O 7− x
Author(s) -
Binder Joachim R.,
Wedemeyer Horst,
Reuter Hans
Publication year - 1997
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.19970091312
Subject(s) - thermal decomposition , materials science , decomposition , characterization (materials science) , group 2 organometallic chemistry , thin film , thermal , chemical engineering , inorganic chemistry , nanotechnology , organic chemistry , molecule , chemistry , thermodynamics , physics , engineering
Why are the carrier densities of YBa 2 Cu 3 O 7−x smaller in thin films prepared by wet‐chemical methods than in those prepared by other methods? In order to answer this practically relevant question, the chemical reactions taking place need to be known exactly. The thermal decomposition of an organometallic precursor of YBa 2 Cu 3 O 7−x —an important step in the wet‐chemical preparation–has been investigated by the simultaneous application of dynamic and static characterization methods and the results are reported here.