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Room temperature silicon wafer bonding with ultra‐thin polymer films
Author(s) -
Kräuter Gertrud,
Schumacher Andreas,
Gösele Ulrich,
Jaworek Thomas,
Wegner Gerhard
Publication year - 1997
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.19970090512
Subject(s) - materials science , microelectronics , wafer , polymer , anodic bonding , wafer bonding , silicon , layer (electronics) , fabrication , surface roughness , thermocompression bonding , surface finish , tin , composite material , nanotechnology , optoelectronics , metallurgy , medicine , alternative medicine , pathology
Bonding of silicon wafers is required in microelectronics fabrication, for example. A room‐temperature bonding process that leads to sufficient bond strength is necessary for bonding semi‐processed wafers, i.e., those already containing temperature‐sensitive structures. The room‐temperature bonding of hydrophobic wafers is reported for the first time, an ultra‐tin Langmuir‐Blodgett film of a “hairy” rod‐like polymer being used as an intermediate layer. The effect of the polymer layer on the surface roughness is investigated and possible directions o future work are indicated.