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Silicon wafer bonding via designed monolayers **
Author(s) -
Gösele Ulrich,
Steinnkirchner Johann,
Martini Torsten,
Reiche Manfred,
Kästner Gerhard
Publication year - 1995
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.19950070714
Subject(s) - microelectronics , materials science , wafer , wafer bonding , silicon , anodic bonding , nanotechnology , electronics , optoelectronics , engineering physics , electrical engineering , engineering
Silicon wafer bonding is a technology which allows two silicon wafers to stick together without any glue (e.g. see Fig.). The technique is used in the areas of microelectronics, micromechanics, and power electronics. Hydrolyzed tetramethoxysilane is used in he new bonding process presented here, providing a low‐temperature method of wafer bonding compatible with the presence of microelectronics aluminum metallization.