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Electrical contactswith low resistance for melt‐processed high‐ T c Superconductors
Author(s) -
Elschner Steffen,
Bock Joachim
Publication year - 1992
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.19920040319
Subject(s) - materials science , superconductivity , sputtering , thermal stability , electrical resistance and conductance , deposition (geology) , electrical resistivity and conductivity , thermal , high temperature superconductivity , metallurgy , engineering physics , optoelectronics , composite material , nanotechnology , thin film , condensed matter physics , chemical engineering , electrical engineering , paleontology , physics , sediment , meteorology , engineering , biology
Low electrical resistance and high thermal and mechanical stability are required of the materials used to connect ssuperconducting materials with normal conducting leads. The sputter deposition of silver or gold layers into melt‐processed BSCCO superconducting material results in contacts in the mω range which is too high for high‐current applications. An alternative method is presented which takes advantage of the BSCCO production method and requires no additional processing steps.