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Inorganic materials V . Ceramic materials possessing high thermal conductivity
Author(s) -
Partridge Graham
Publication year - 1992
Publication title -
advanced materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 10.707
H-Index - 527
eISSN - 1521-4095
pISSN - 0935-9648
DOI - 10.1002/adma.19920040112
Subject(s) - materials science , ceramic , thermal conductivity , miniaturization , diamond , boron nitride , silicon carbide , dielectric , nitride , carbide , boron carbide , silicon nitride , thermal management of electronic devices and systems , composite material , engineering physics , nanotechnology , silicon , metallurgy , optoelectronics , mechanical engineering , layer (electronics) , engineering
Inorganic Materials V : Insulating dielectric materials which prossess a high thermal conductivity are required for the dissipation of heat from electrical and electronic equipment. As dissippation requirements increase with the miniaturization of circuitry, materials such as diamond, boron nitride, and silicon carbide are being used to replace alumina. The various materials and their applications are discussed.