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Wireless Power Transfer and Telemetry for Implantable Bioelectronics
Author(s) -
Yoo Seungwon,
Lee Jonghun,
Joo Hyunwoo,
Sunwoo SungHyuk,
Kim Sanghoek,
Kim DaeHyeong
Publication year - 2021
Publication title -
advanced healthcare materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.288
H-Index - 90
eISSN - 2192-2659
pISSN - 2192-2640
DOI - 10.1002/adhm.202100614
Subject(s) - bioelectronics , interfacing , telemetry , wireless power transfer , wireless , biotelemetry , electronics , energy harvesting , electrical engineering , energy transfer , microwave , computer science , materials science , power (physics) , nanotechnology , engineering , telecommunications , computer hardware , engineering physics , physics , quantum mechanics , biosensor
Abstract Implantable bioelectronic devices are becoming useful and prospective solutions for various diseases owing to their ability to monitor or manipulate body functions. However, conventional implantable devices (e.g., pacemaker and neurostimulator) are still bulky and rigid, which is mostly due to the energy storage component. In addition to mechanical mismatch between the bulky and rigid implantable device and the soft human tissue, another significant drawback is that the entire device should be surgically replaced once the initially stored energy is exhausted. Besides, retrieving physiological information across a closed epidermis is a tricky procedure. However, wireless interfaces for power and data transfer utilizing radio frequency (RF) microwave offer a promising solution for resolving such issues. While the RF interfacing devices for power and data transfer are extensively investigated and developed using conventional electronics, their application to implantable bioelectronics is still a challenge owing to the constraints and requirements of in vivo environments, such as mechanical softness, small module size, tissue attenuation, and biocompatibility. This work elucidates the recent advances in RF‐based power transfer and telemetry for implantable bioelectronics to tackle such challenges.