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Polyelectrolyte Multilayer Coating of 3D Scaffolds Enhances Tissue Growth and Gene Delivery: Non‐Invasive and Label‐Free Assessment
Author(s) -
Holmes Christina,
Daoud Jamal,
Bagnaninchi Pierre O.,
Tabrizian Maryam
Publication year - 2014
Publication title -
advanced healthcare materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 2.288
H-Index - 90
eISSN - 2192-2659
pISSN - 2192-2640
DOI - 10.1002/adhm.201300301
Subject(s) - polyelectrolyte , materials science , gene delivery , tissue engineering , scaffold , nanotechnology , viability assay , chitosan , biomedical engineering , transfection , coating , polymer , in vitro , chemistry , biochemistry , gene , composite material , medicine
Layer‐by‐layer (LbL) deposition is a versatile technique which is beginning to be be explored for inductive tissue engineering applications. Here, it is demonstrated that a polyelectrolyte multilayer film system composed of glycol‐chitosan (Glyc‐CHI) and hyaluronic acid (HA) can be used to coat 3D micro‐fabricated polymeric tissue engineering scaffolds. In order to overcome many of the limitations associated with conventional techniques for assessing cell growth and viability within 3D scaffolds, two novel, real‐time, label‐free techniques are introduced: impedance monitoring and optical coherence phase microscopy. Using these methods, it is shown that LbL‐coated scaffolds support in vitro cell growth and viability for a period of at least two weeks at levels higher than uncoated controls. These polyelectrolyte multilayer coatings are then further adapted for non‐viral gene delivery applications via incorporation of DNA carrier lipoplexes. Scaffold‐based delivery of the enhanced green fluorescent protein (EGFP) marker gene from these coatings is successfully demonstrated in vitro, achieving a two‐fold increase in transfection efficiency compared with control scaffolds. These results show the great potential of Glyc‐CHI/HA polyelectrolyte multilayer films for a variety of gene delivery and inductive tissue engineering applications.