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Interfacial Cladding Engineering Suppresses Atomic Thermal Migration to Fabricate Well‐Defined Dual‐Atom Electrocatalysts (Adv. Funct. Mater. 41/2022)
Author(s) -
Leng Kunyue,
Zhang Jianting,
Wang Yi,
Li Dingding,
Bai Lei,
Shi Jingbo,
Li Xiaolin,
Zheng Lirong,
Bai Jinbo,
Qu Yunteng
Publication year - 2022
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.202270227
Subject(s) - materials science , cladding (metalworking) , atom (system on chip) , nanotechnology , dual (grammatical number) , thermal , composite material , thermodynamics , art , literature , computer science , embedded system , physics
Dual‐Atom Electrocatalysts In article number 2205637, Xiaolin Li, Lirong Zheng, Jinbo Bai, Yunteng Qu, and co‐workers show that the interfacial cladding strategy successfully enables confinement protection of paired metal atoms by two carbon layers, and gains well‐defined dual‐atom sites anchored in hollow cubic carbon. Among them, the most representative dual Fe catalyst shows great potential in electrochemical energy conversion.