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Electron Beam Lithography: CO 2 ‐Based Dual‐Tone Resists for Electron Beam Lithography (Adv. Funct. Mater. 13/2021)
Author(s) -
Lu XinYu,
Luo Hao,
Wang Kai,
Zhang YaoYao,
Zhu XiaoFeng,
Li Dongxue,
Ma Bingze,
Xiong Shisheng,
Nealey Paul F.,
Li Qiang,
Wu GuangPeng
Publication year - 2021
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.202170086
Subject(s) - resist , electron beam lithography , materials science , lithography , cathode ray , tone (literature) , extreme ultraviolet lithography , x ray lithography , beam (structure) , optoelectronics , next generation lithography , optics , copolymer , dual (grammatical number) , nanotechnology , electron , polymer , composite material , physics , art , literature , layer (electronics) , quantum mechanics
In article number 2007417, Paul F. Nealey, Qiang Li, Guang‐Peng Wu, and co‐workers discover that CO 2 ‐based polycarbonates produced by the copolymerization of CO 2 and epoxides could be utilized as qualified positive and negative resists for electron beam lithography, as demonstrated by their features of full sustainability, outstanding sensitivity, high resolution, and the finely manufactured photonic crystal devices in both positive and negative tones.