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3D Copper Circuits: Form‐Factor Free 3D Copper Circuits by Surface‐Conformal Direct Printing and Laser Writing (Adv. Funct. Mater. 45/2020)
Author(s) -
Jo Yejin,
Park Hye Jin,
Kim YoungBin,
Lee Sun Sook,
Lee Su Yeon,
Kim SunKyung,
Choi Youngmin,
Jeong Sunho
Publication year - 2020
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.202070299
Subject(s) - materials science , conformal map , laser , electronic circuit , copper , electrical conductor , optoelectronics , nanotechnology , optics , composite material , electrical engineering , metallurgy , physics , geometry , mathematics , engineering
In article number 2004659, Sun‐Kyung Kim, Youngmin Choi, Sunho Jeong, and co‐workers propose multi‐dimensional particles that allow for deep penetration of incident photons in the surface‐conformal laser writing process. Highly conductive 3D Cu features for form‐factor free electrical circuits are created simply via successive 3D printing and laser writing processes.