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Thermal Boundary Conductance: Visualizing Energy Transfer at Buried Interfaces in Layered Materials Using Picosecond X‐Rays (Adv. Funct. Mater. 34/2020)
Author(s) -
Nyby Clara,
Sood Aditya,
Zalden Peter,
Gabourie Alexander J.,
Muscher Philipp,
Rhodes Daniel,
Mannebach Ehren,
Corbett Jeff,
Mehta Apurva,
Pop Eric,
Heinz Tony F.,
Lindenberg Aaron M.
Publication year - 2020
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.202070232
Subject(s) - materials science , van der waals force , picosecond , nanoscopic scale , thermal , dissipation , thermal conductivity , heat transfer , characterization (materials science) , electronics , thermal management of electronic devices and systems , nanotechnology , optoelectronics , composite material , optics , mechanics , thermodynamics , chemistry , molecule , mechanical engineering , physics , engineering , laser , organic chemistry
In article number 2002282, Aaron M. Lindenberg and co‐workers demonstrate a new technique for observing interfacial heat transport in nanoscale van der Waals layered materials using time‐resolved X‐ray measurements of photoinduced thermal strain. This approach paves the way for non‐invasive, localized characterization of thermal bottlenecks in emerging 3D heterogeneous electronics where heat dissipation can severely limit performance.