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Newly Synthesized Nonvacuum Processed High‐k Polymeric Dielectrics with Carboxyl Functionality for Highly Stable Operating Printed Transistor Applications
Author(s) -
Kwon Hyeokjin,
Ye Heqing,
Shim Kyuwon,
Girma Henok Getachew,
Tang Xiaowu,
Lim Bogyu,
Kim Yejin,
Lee Jihoon,
Park Chan Eon,
Jung SeoHyun,
Park Jong Mok,
Jung Yu Jin,
Hwang DoHoon,
Kong Hoyoul,
Kim Se Hyun
Publication year - 2021
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.202007304
Subject(s) - materials science , dielectric , transistor , fabrication , polymer , thin film transistor , high κ dielectric , chemical engineering , optoelectronics , nanotechnology , voltage , composite material , layer (electronics) , electrical engineering , medicine , alternative medicine , pathology , engineering
Solution‐processed polar hydroxyl containing polymers such as poly(4‐vinylphenol) are widely utilized in organic filed‐effect transistors (OFETs) due to their high dielectric constant (k) and excellent insulating properties owing to the crosslinking through their hydroxyl groups. However, hydroxyl functionalities can function as trapsites, and their crosslinking reactions decrease the k value of materials. Hence, in this study, new solution‐processable copolymers containing both carboxyl and hydrophobic functionalities are synthesized. A fluorophenyl azide (FPA) based UV‐assisted crosslinker is also employed to promote the movement of polar carboxyl groups toward the bulk region and the hydrophobic functionalities to the surface region, thereby maintaining the high‐k characteristics and hydrophobic surface in thin film. Thus, the addition of an FPA crosslinker eliminates the trapsites on the surface, allowing a stable operation and efficient charge transport. Additionally, the solution‐processability enables the production of uniform and thin films to yield OFETs with stable and low‐voltage driving characteristics. The printed layers are also applied as gate dielectrics for floating gate memory devices and in integrated one‐transistor‐one‐transistor based memory cells, displaying their excellent memory performance. The synthesis and fabrication strategies employed in this study can become useful guidelines for the production of high‐k dielectrics for stable OFETs and other applications.