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Degradable Electronics: Wafer‐Scale High‐Yield Manufacturing of Degradable Electronics for Environmental Monitoring (Adv. Funct. Mater. 50/2019)
Author(s) -
Xiang Li,
Xia Fan,
Zhang Heng,
Liu Youdi,
Liu Fang,
Liang Xuelei,
Hu Youfan
Publication year - 2019
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.201970339
Subject(s) - electronics , wafer , materials science , yield (engineering) , nanotechnology , scale (ratio) , electrical engineering , engineering , composite material , physics , quantum mechanics
In article number 1905518, Youfan Hu and co‐workers develop a wafer‐scale high‐yield manufacturing process for degradable electronics with a degradable system for real‐time environmental monitoring. High device yields, high‐uniformity, and great performance are achieved simultaneously, which provide new opportunities for degradable electronics for next‐generation ecofriendly sensing platforms for the coming Internet of Things era.