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Composite Materials: Functional Soft Composites As Thermal Protecting Substrates for Wearable Electronics (Adv. Funct. Mater. 45/2019)
Author(s) -
Shi Yingli,
Wang Chengjun,
Yin Yafei,
Li Yuhang,
Xing Yufeng,
Song Jizhou
Publication year - 2019
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.201970314
Subject(s) - materials science , composite number , composite material , electronics , substrate (aquarium) , wearable technology , thermal , soft materials , wearable computer , nanotechnology , computer science , electrical engineering , oceanography , physics , geology , meteorology , embedded system , engineering
In article number 1905470, Yuhang Li, Jizhou Song, and co‐workers report a functional soft composite, which incorporates an embedded phase change material with a thin metal film on the top in a soft polymer, as a thermal protection substrate for wearable electronics. Compared with conventional substrates, the proposed functional soft composite offers novel routes to manipulate heat flow and absorb excessive heat energy, which can reduce the peak temperature increase by 85%.