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Flexible Electronics: Heat‐Free Fabrication of Metallic Interconnects for Flexible/Wearable Devices (Adv. Funct. Mater. 40/2019)
Author(s) -
Martin Andrew,
Chang Boyce S.,
Martin Zachariah,
Paramanik Dipak,
Frankiewicz Christophe,
Kundu Souvik,
Tevis Ian D.,
Thuo Martin
Publication year - 2019
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.201970278
Subject(s) - materials science , fabrication , electrical conductor , electronics , nanotechnology , flexible electronics , wearable technology , metal , hinge , wearable computer , composite material , optoelectronics , mechanical engineering , metallurgy , electrical engineering , computer science , medicine , alternative medicine , pathology , embedded system , engineering
In article number 1903687, Martin Thuo and co‐workers describe a unique heat‐free approach for the fabrication of conductive metallic interconnects on diverse types of substrates. This method hinges on undercooled metal particles fabricated by encapsulating molten metal in thin shells to enable solidification. A collection of these particles sinter under benign chemical stimuli or low mechanical load.