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Hybrid Materials: Flexible and Ultrasoft Inorganic 1D Semiconductor and Heterostructure Systems Based on SnIP (Adv. Funct. Mater. 18/2019)
Author(s) -
Ott Claudia,
Reiter Felix,
Baumgartner Maximilian,
Pielmeier Markus,
Vogel Anna,
Walke Patrick,
Burger Stefan,
Ehrenreich Michael,
Kieslich Gregor,
Daisenberger Dominik,
Armstrong Jeff,
Thakur Ujwal Kumar,
Kumar Pawan,
Chen Shunda,
Donadio Davide,
Walter Lisa S.,
Weitz R. Thomas,
Shankar Karthik,
Nilges Tom
Publication year - 2019
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.201970120
Subject(s) - materials science , heterojunction , semiconductor , hybrid material , nanotechnology , optoelectronics
In article number 1900233 , Gregor Kieslich, Karthik Shankar, Tom Nilges, and co‐workers, prepare organic and inorganic hybrids, illustrating that SnIP is a candidate to fabricate flexible 1D composites for energy conversion and water splitting applications. SnIP@C 3 N 4 hybrid forms an unusual soft material core–shell topology with graphenic carbon nitride wrapping around SnIP.