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Fluidic Flow Assisted Deterministic Folding of Van der Waals Materials
Author(s) -
Zhao Huan,
Wang Beibei,
Liu Fanxin,
Yan Xiaodong,
Wang Haozhe,
Leong Wei Sun,
Stevens Mark J.,
Vashishta Priya,
Nakano Aiichiro,
Kong Jing,
Kalia Rajiv,
Wang Han
Publication year - 2020
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.201908691
Subject(s) - van der waals force , materials science , folding (dsp implementation) , nanotechnology , stacking , atomic units , fluidics , pyramid (geometry) , physics , mechanical engineering , aerospace engineering , optics , molecule , nuclear magnetic resonance , quantum mechanics , engineering
Origami offers a distinct approach for designing and engineering new material structures and properties. The folding and stacking of atomically thin van der Waals (vdW) materials, for example, can lead to intriguing new physical properties including bandgap tuning, Van Hove singularity, and superconductivity. On the other hand, achieving well‐controlled folding of vdW materials with high spatial precision has been extremely challenging and difficult to scale toward large areas. Here, a deterministic technique is reported to fold vdW materials at a defined position and direction using microfluidic forces. Electron beam lithography (EBL) is utilized to define the folding area, which allows precise control of the folding geometry, direction, and position beyond 100 nm resolution. Using this technique, single‐atomic‐layer vdW materials or their heterostructures can be folded without the need for any external supporting layers in the final folded structure. In addition, arrays of patterns can be folded across a large area using this technique and electronic devices that can reconfigure device functionalities through folding are also demonstrated. Such scalable formation of folded vdW material structures with high precision can lead to the creation of new atomic‐scale materials and superlattices as well as opening the door to realizing foldable and reconfigurable electronics.