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Electronic Stuctures: Mechanically Guided Post‐Assembly of 3D Electronic Systems (Adv. Funct. Mater. 48/2018)
Author(s) -
Kim Bong Hoon,
Liu Fei,
Yu Yongjoon,
Jang Hokyung,
Xie Zhaoqian,
Li Kan,
Lee Jungyup,
Jeong Ji Yoon,
Ryu Arin,
Lee Yechan,
Kim Do Hoon,
Wang Xueju,
Lee KunHyuck,
Lee Jong Yoon,
Won Sang Min,
Oh Nuri,
Kim Jeonghyun,
Kim Ju Young,
Jeong SeongJun,
Jang KyungIn,
Lee Seungmin,
Huang Yonggang,
Zhang Yihui,
Rogers John A.
Publication year - 2018
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.201870344
Subject(s) - materials science , leverage (statistics) , nanotechnology , 3d printed , flexible electronics , printed circuit board , planar , electronics , computer science , manufacturing engineering , electrical engineering , engineering , artificial intelligence , computer graphics (images)
In article number 1803149 , Yonggang Huang, Yihui Zhang, John A. Rogers, and co‐workers present deterministic assembly processes for transforming conventional, planar devices based on flexible printed circuit board (FPCB) platforms into those with 3D architectures in a manner that is fully compatible with off‐the‐shelf packaged or unpackaged component parts. The strategy to 3D FPCB technologies creates immediate opportunities for designs in multifunctional systems that leverage state‐of‐the‐art components.